Via Fill Operator (Swing)

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.

Job Purpose

Candidate will work in the Epoxy Via Fill department. The qualified individual will be working with Peters, Tayio and San Ei epoxies.

Nature of Duties/Responsibilities

• Must be able to follow vendor recommendation for baking epoxy.
• The process requires to bake panels, via fill, bake panels to cure the epoxy, via fill touch up, planarization, inspection of panels.
• Willbe taping the edges of panels and preparing panels for Via Fill process.
• Candidate should also be able to planerize product.

Education and Experience

• High School
• Minimum 1 year experience in PCB industry.
• Must be able to follow instructions and have ability to learn new processes.
• Must have good attention to detail and good quality.
• Must be available to work overtime and weekends
• Must have good verbal and written communication skills

This is an ITAR facility and applicant must be a US Citizen or a lawful permanent resident.

Sanmina is an Equal Opportunity Employer - M/F/Veteran/Disability/Sexual Orientation/Gender Identity

Salary Range(annual): $39,520.00 - $43,680.00